2008 edition of China’s semiconductor chip packaging industry, plastic materials research report excerpts

  World Semiconductor chip package is divided into metal packaging, glass packaging, ceramic packaging and plastic packaging is currently more than 95% of the semiconductor chips are plastic packaging; chips by end-use plastic packaging materials, appearance of the difference can be divided into solid epoxy mold Plastic (Epoxy Molding Compound, EMC, usually called the plastic materials used), or transfer of injection molding, said molding material, the liquid plastic material (Liquid Molding Compound), the bottom of the filling glue (Underfill) three categories, on a scale to EMC’s largest solid-state; EMC the twentieth century, the fifties and sixties originated in the United States, eight, nineties to flourish in Japan, now that China has rapidly emerged as the two major manufacturing countries in the world, one of EMC, EMC manufacturing in China began in the twentieth century, the early eighties; is expected in 2007 EMC annual global demand for about 17 million tons, the demand for EMC in China about 45,000 tons; 2006 annual EMC sales of the top three semiconductor manufacturers in the world for Japan’s Sumitomo Bakelite, Henkel Huawei Electronics Co., Ltd. (China), Japan’s Nitto electrician; 2007 annual revenues of China’s chip package, the top two vendors for the EMC Henkel Huawei Electronics Co. Ltd. and Sumitomo Bakelite Co., Ltd., Suzhou.

First, the basic situation of China’s manufacturing enterprises EMC

EMC enterprises in China producing about 19 major companies are representative of Annex 8, as well as Japan’s Nitto Denko and other overseas manufacturers in China hit cake factory built EMC.

  By the end of 2006, Guangdong Yung Thai Industrial Co., Ltd. (Guangdong Yung-tai 600,589) Board of Directors passed a resolution, decided to invest 108.85 million yuan building green environmental protection type IC chips used in plastic packaging materials project; the project was originally scheduled for trial operation in 2007, but was postponed to the first half of 2008 production, project planning capacity of 500 tons, plans for the future expansion to 3,000 tons / year, will help improve China’s epoxy molding compound product mix and market structure; listed company involved in chip industry, plastic materials, which greatly benefit plastic materials to improve chip industry in the general public’s awareness and recognition to promote the industry, brand building. Other private-chip companies to join plastic materials, mainly low-level redundant construction, China’s chip low-end plastic material apparent excess production capacity, price competition more heated.

Henkel Huawei Electronics Co., Ltd. joint venture after the new chip, molding compound plant in October 2007 in Lianyungang, a formal operation, which makes Henkel Huawei Electronics molding compound annual total production capacity to 3.6 million tons, is the world’s largest single ring Oxygen plastic materials factory.

Research the end of 2007, mainland China EMC combined total capacity of about 80,000 tons, of which Henkel Huawei Electronics Co., Ltd., Suzhou Sumitomo Bakelite Co., Ltd., Changchun Feng Plastics (Changshu) Co., Ltd. Changxing Electronic Materials (Kunshan) Co., Ltd., Hitachi Chemical Industry (Suzhou) Co., Ltd., 5 total 62,000 tons, accounting for 78.5% of total capacity; other manufacturers production capacity of 18000 tons, accounting for 22.5% of total capacity. EMC is expected by the end of 2008 China’s total capacity to more than 80,000 tons.

2007 package with the EMC in China about 44,000 tons with a total, mainland China makers about Qi Cheng, overseas imports into the EMC about three the next few years the growth rate of about 15%.

China EMC characteristics of the geographical distribution of manufacturing enterprises was relatively concentrated distribution of the characteristics of the semiconductor package is currently focused on the relative concentration of the Yangtze River Delta region companies, production capacity about 86%; Lianyungang and Suzhou is not only in China, and the world semiconductor EMC town; Henkel China Wei Electronics Co., Ltd. (China), a production capacity accounted for 45% of the country is the world’s largest production base for semiconductor EMC.

Second, Chinese EMC market for the distribution of manufacturing enterprises

EMC manufacturing enterprises in China mainly concentrated in the semiconductor packaging market, relative to concentration of the Yangtze River Delta region, Pearl River Delta region, as well as Beijing and Tianjin area, the western region and other places; the main market in order to meet domestic demand in mainland China, but export volume growth has accelerated noticeably.

Henkel Huawei Electronics Co., Ltd. through a joint venture integrating the United States and the original old brand Hysol Huawei Electronics Co., Ltd. Jiangsu, China Light and Power resources, become the world’s big three, one of EMC, is the only ranked the world’s top three semiconductor chip packaging materials in China mainland China manufacturers, global marketing, and Hysol two Hysol-Huawei brand, the traditional black, anhydride materials, gold and other materials, the three major categories, KL-/MG, KL-G/GR four series of solid-state EMC (Henkel E-supply of liquid can be plastic packaging materials, filling the bottom of the plastic, etc.), changed the world semiconductor EMC mainly monopolized by Japanese companies, industry competition pattern; 2007 Henkel Huawei Electronics Co., Ltd. to undertake conversions Hysol brand EMC, has been a significant supply of overseas international packaging giant, has stronger international competitiveness, as the U.S. Hysol Factory EMC products in 2008 will be fully transferred to Henkel Huawei Electronics Co., Ltd. production and accelerate the expansion of overseas markets and other enterprises to expand overseas markets, China’s manufactured exports will be EMC rapid growth is expected to lead China to become the world’s largest producer of semiconductor EMC is expected that China has become the world’s production EMC’s second-largest producer.

Germany’s Henkel Group is the world’s only offer from a semiconductor packaging materials to the full range of electronic assembly materials, electronic materials manufacturers, has the world’s advanced packaging and general packaging client resources, to Henkel Huawei Electronics Co., the world’s promotion of green EMC offers new products channels to facilitate access, especially in the first half of 2008, Henkel has acquired the U.S. e-National Starch and Chemical Company, its subsidiaries Ablestik is to create a world leader in silicon adhesives, collaborative marketing advantage more pronounced. We have reason to believe that Henkel Huawei Electronics Co., Ltd. in the near future be able to grow into the world’s largest semiconductor manufacturers EMC; Henkel Huawei vision: to become the preferred brand worldwide semiconductor molding compounds

3, production and technical conditions

EMC with epoxy resin on the current international system is divided into: ECON, DCPD, Bi-Pheny1 and Multi-Function-type and so on. Chinese products are mainly focused on domestic-owned small and medium enterprises ECON-type epoxy resin system, EMC, applies to a wide range of China, a large quantity of diodes, transistors and other common packages for SMEs, but there is a low degree of brand awareness, product consistency is poor, and technical strength of weak an urgent need to solve the problem.

EMC also special requirements of 5-10 ℃ low temperature refrigerated transport and storage, resulting in high logistics costs, thereby constraining the lack of resources, small-scale Chinese medium and small manufacturers to expand the national market, usually the low end of the market for the local area-specific discrete devices customers with low price competition.

SOT, SSOP, TSOP, QFP, TQFP, etc. EMC is currently used in advanced packaging Henkel Huawei Electronics Co., Ltd., Sumitomo Bakelite Co., Ltd., Suzhou has a large-scale production capacity, and has been encapsulated in the domestic foreign-funded enterprises in large-scale use, accounting for dominant position; Henkel Huawei Electronics Co., Ltd. sold first, the second high-grade EMC sales, with the vast majority of China’s packaging industry’s need for high, medium and low-end epoxy molding compound, product line is complete. Henkel Huawei Electronics Co., Ltd. is currently produced by SSOP, TQFP, QFN, BGA and other advanced packaging used by EMC reached the international advanced level, and has been fully endorsed by the market, the rapid expansion of production and sales; Suzhou Sumitomo Bakelite Co., Ltd. mainly IC packages, high-end products mainly occupy the leading position.

MCM (MCP), FBP, BGA, CSP, MEMS, SiP and other advanced sealing closure with the EMC is still the main imports, local manufacture of EMC is still to promote testing, certification, on the amount of process.

International trends in green packaging There are two requirements for the EMC, we must first lead-free, but it must withstand the test conditions of 260 ℃ lead-free processes; the other is from a non-green to green transition to non-bromine, antimony and other non – . In order to actively respond to the European Union RoSH, WEEE and China, “Electronic Information Products Pollution Control Management Measures” of the implementation of marketing and facilitate the recognition segment, we will be re-classified as common type EMC (to meet the RoHS for Pb, Hg, Cd, Cr + 6, PBB, PBDE and other six kinds of hazardous substances in limited request), lead-free low-stress type (not only to meet the RoHS hazardous substances on the six kinds of the limited demand, but also to meet the 260 ℃ reflow process requirements), green non-brominated, non-antimony type (not only to meet the RoHS hazardous substances on the six kinds of the limited requirements to meet the 260 ℃ reflow process requirements, but also non-brominated, non-antimony, etc.) three categories.

Plastic materials are now the major global manufacturers are developing green molding compounds invested a lot of energy, how to research and development of green molding compound plastic materials has become a global industry focus. At present, through the R & D staff for their hard exploration, does not contain the traditional bromine / antimony flame retardants halogenated alternatives have been no problem, but also to meet the UL V-0 flame-retardant standards. However, according to MSL-JEDEC reliability of assessment criteria, there must be 260 ℃ high temperature lead-free reflow soldering, in which assessment in the high-temperature reliability issues often arise, it is difficult to pass MSL1: 85 ℃ / 85% / 168H + IR REFLOW 260 ℃ 3 times that an assessment, even MSL2: 85 ℃ / 60% / 168H + IR REFLOW260 ℃ 3 times assessment, but MSL3: 30 ℃ / 60% / 192H + IR REFLOW260 ℃ 3 times more easily through the examination. How to solve technical problems and high reliability, cost reduction is currently the development and promotion of environmentally friendly plastic material of the main research topic, this is a re-shuffling of the process of global market opportunities and challenges, especially in the EMC-owned small and medium domestic producers, may the challenge is more on the opportunities.

Henkel Huawei Electronics Co., Ltd. Hysol-Huawei KL-G730-1, KL-G800, KL-G680H, KL-G450H, KL-G100 and Hysol GR9820, GR825, GR360 series of green EMC has received international and domestic markets, fully recognized and widely used; Sumitomo Bakelite Co., Ltd., Suzhou production of EME-G600, EME-G700 and other green EMC in the large-scale use; Hitachi Chemical (Suzhou) Co., Ltd. market positioning EMC high-end materials and green-based, its green EMC products performance in the market have a certain competitive edge.

EMC faced with high-temperature green reliability, high-cost, continuous molding difficult challenge of sexual and other industries need to coordinate with the relevant manufacturers tackle tough. There are currently Taiwan’s Metal Industries Research and Development Center launched anti-stick mold coating sewage treatment, said packaging can improve production efficiency more than 80%; the lead frame requirements of international packaging plants in the plant to change the product mix in order to enhance its integration with the EMC capability.

4, R & D capabilities of

Professional R & D institutions: Henkel Huawei Electronics Co., Ltd. of Jiangsu Province, IC packaging materials engineering and technology research centers and R & D Center of Henkel United States, Beijing Microelectronics Co., Ltd. Relying on the First Section of Chemistry, Chinese Academy of Sciences; foreign-invested enterprises in Suzhou Sumitomo Bakelite Co., Ltd., Changxing Electronic Materials (Kunshan) Co., Ltd., Hitachi Chemical Industry (Suzhou) Co., Ltd. R & D centers overseas, and other domestic companies are no EMC professional R & D institutions.

Henkel Huawei Electronics Co., Ltd., Jiangsu Province, IC packaging material has a Engineering Research Center, the state post-doctoral research station, and the state’s 863 plan ULSI supporting EMC research project is the outcome of the industrialization of the State 863 Program one of the bases, in addition to combination of Henkel U.S. R & D Center developed many new products have reached world advanced level, its green EMC line with international standards in industrial production, leading position in the international arena.

Beijing Microelectronics Co., Ltd. Relying on the First Section of Chemistry, Chinese Academy of Sciences, in the EMC-based theory and research of new products have some advantages.

6, development of the industry status quo

With the strength and size of enterprises are mainly Henkel Huawei, Sumitomo / Changchun, two companies; other foreign-funded development of the company also built and has a process; other Chinese-funded companies, then there exists a small scale of production, product consistency is poor, technical force is relatively weak problems, mainly to price competition.

5, product structure

SOT, SSOP, QFP, TQFP packages such as mainland China has become the mainstream of IC packaging development, and matched by the EMC to local manufacture of foreign-based, supplemented by imports, localization, packaging the procurement of foreign capital enterprises have become the consensus of At present, China mainly include EMC manufacturer Henkel Huawei Electronics Co., Ltd. and Suzhou, Sumitomo Bakelite Co., Ltd., Hitachi Chemical Industry (Suzhou) Co., Ltd. 3. Other EMC products manufacturing enterprises is also concentrated in discrete device packaging with ordinary EMC areas of production.

Henkel Huawei Electronics Co., Ltd. R & D on their own, including QFP, TSSOP, TQFP and QFN, PBGA packages with a variety of EMC, a large number of entering the market, breaking the monopoly of Japanese companies in China a long-term pattern of high-end EMC market, market share is expanded rapidly.

    6, industry trends

With the development of the domestic semiconductor packaging technology and product technology upgrading, particularly from overseas to domestic enterprises to speed up the transfer of packaging, a number of high-end packaging products have on the processing in the mainland market, the requirements of EMC will also be getting higher and higher; new semiconductor packaging technology continues to develop, for new EMC requirements will also be getting higher and higher, the demand for advanced packaging with the EMC will be a larger rate.

In order to meet the development trend of environment-friendly lead-free requirements in the future lead-free package will be green with the EMC-type direction, EMC and foreign enterprises are facing new challenges and re-integration.

With the packaging business professional, large-scale development, the future production of EMC will also lead to the green environmental protection, high-tech, large-scale, low-cost direction. With China’s packaging foundry business customers to accelerate the process of international development, brand identity is a Chinese-funded global customers to small and medium enterprises EMC new challenges.

EMC enterprises to speed up China’s current polarization, and has formed a Sino-German joint venture, Henkel Huawei Electronics Co., Ltd. and Japan’s Sumitomo Sumitomo Bakelite Co., Ltd. in Suzhou owned two giants led by warlords and foreign separatist disputes in the market; as China OEM packaging companies and their customers on the packaging material manufacturers require global brand identity, supporting materials, technology, services, accelerated development of the local trend is expected in the future China and the world EMC enterprise market concentration will be further enhanced.

7 Concluding Remarks

The next three years will be China’s domestic transformation of EMC enterprise product technology upgrade to meet the challenges and breakthroughs in green lead-free package, the brand an international recognition of the critical period; China’s domestic manufacturing enterprises EMC’s position in the world semiconductor industry will be further enhanced, is expected to near the future, China is expected to become the world’s largest producer of EMC, and in overseas markets also played an important role.